2025 Bay Area Semiconductor Ecosystem Expo | DeepChip Alliance Members Shine As A Defining Force

Oct 30, 2025

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2025 Bay Area Semiconductor Ecosystem Expo | DeepChip Alliance Members Shine as a Defining Force

 

The 2025 Bay Area Semiconductor Ecosystem Expo (BAYCHIP Expo) concluded successfully, yet the technological vitality and innovation momentum it unleashed continue to resonate across the industry. Relying on a robust network of over 1,400 member enterprises, the DeepChip Alliance (Shenxinmeng) has built four core ecosystems - industry, talent, capital, and technology - to empower the semiconductor community. By creating a high-efficiency platform for business development, collaboration, and resource integration, the Alliance provided exhibitors and partners with top-tier business matchmaking and comprehensive connections from R&D to market commercialization.

 

At this year's exhibition, DeepChip Alliance members showcased their cutting-edge innovations and solid technical capabilities. Their exhibits covered critical segments of the semiconductor value chain - including chip design, manufacturing, packaging and testing, equipment, and materials - fully demonstrating the vitality and creativity of the Bay Area semiconductor ecosystem. Together, they formed a striking "Alliance Landscape" on the show floor.

 


Tuojing Technology

 

During the exhibition, Tuojing Technology showcased four key equipment models - NF-300M Supra-H, PF-300M Supra-D, Dione 300, and VS-300T, spanning two major domains: thin-film deposition and advanced packaging.


To further promote technical exchange, the company organized five technical presentations on topics such as thin-film process optimization, advanced packaging applications, and capacity enhancement. These sessions drew significant attention from industry professionals, underscoring Tuojing's leadership in semiconductor process technologies.

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ACM Research (Huahai Qingke)

 

ACM Research presented a comprehensive portfolio of high-end semiconductor equipment covering chemical mechanical polishing (CMP), ion implantation, grinding, dicing, edge polishing, and cleaning systems. These products are widely applied across integrated circuits, advanced packaging, large silicon wafers, third-generation semiconductors, MEMS, and Micro LED manufacturing.


The company's newly launched product series - particularly its ion implanter and complete cut-grind-polish (CMP) solutions for 3D IC applications - captured strong industry interest and highlighted ACM's exceptional integrated capabilities in semiconductor equipment development.

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FerroTec Group

 

As a leading domestic supplier of key semiconductor materials, core components, and refurbishment/testing services, FerroTec Group (China) participated with over a dozen business divisions, including cleaning systems, copper-clad ceramic substrates, vacuum components, quartz, silicon parts, crucibles, chillers, ceramics, wafer reclaiming, SiC wafers, sensors, and specialty metals (e.g., showerheads, valves, and bellows).


In addition, Zhongxin Wafer, a FerroTec subsidiary, exhibited independently - together presenting the group's comprehensive capabilities in the semiconductor ecosystem at the BAYCHIP Expo 2025.

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Shanghai Precise Measurement Semiconductor (PMS)

 

A subsidiary of Precise Measurement Electronics Group, Shanghai PMS made an impressive appearance with six major series of front-end process metrology equipment. Leveraging expertise in spectroscopic ellipsometry, optical interferometry, optical microscopy, electron/ion beam imaging, and electrical testing, the company demonstrated its leadership in process control and yield management solutions.


PMS's participation highlighted its cutting-edge innovations and R&D strength in the field of semiconductor metrology, drawing widespread recognition from the industry.

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Etown Corporation

 

As a specialist in semiconductor equipment and system solutions, Etown Corporation showcased its plasma ashing, plasma etching, and rapid thermal annealing (RTA) systems, which are widely adopted by global logic and memory chip manufacturers.


During the event, Etown exhibited its latest plasma etching and millisecond annealing systems, attracting visits from local government officials, wafer fabs, design firms, and materials/equipment suppliers. In-depth discussions focused on collaborative innovation within the global semiconductor supply chain and emerging opportunities in the Chinese market.

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