Nitrogen, A Common Gas in Chip Manufacturing

Nitrogen, a Common Gas in Chip Manufacturing

• Nitrogen, a Common Gas in Chip Manufacturing
• Nitrogen is widely used in chip manufacturing, so knowledge of its uses and applications is crucial.
• I. Physical Properties of Nitrogen: Chemical Symbol: N2
• Molecular Weight: 28.01 (generally considered 28)
• Specific Gravity: 0.967
• Boiling Point: -195.8°C (generally considered -196°C)
• Appearance: Colorless and odorless
• Flammability: Non-flammable
• Safety: Purely asphyxiating and non-toxic, it generally poses no risk. However, high concentrations can cause asphyxiation due to oxygen deprivation. Be careful of leaks and ensure adequate ventilation.
• Reactivity: Very stable, almost unreactive. However, it will react at high temperatures or high temperatures and high pressures to generate nitrides.
• Applicable materials: It is non-corrosive to metals and can be used on all metals. However, when liquefying nitrogen, materials that are not brittle at low temperatures should be selected. Almost all materials are applicable, such as plastics, rubber, etc.

 

II. Uses of nitrogen

(1). Generation of nitrogen: Nitrogen can be extracted through air separation equipment. It can be easily produced in large quantities and cheaply according to the purity required by the factory and supplied through pipelines.

(2). Uses of nitrogen: Cleaning nitrogen can be used to clean impurities and dirt inside and outside semiconductor devices. Cleaning can use the strong action of the air flow to quickly clean the device and reduce damage to the device. Protection During the production and transportation of semiconductor devices, the materials in them need to be protected. Nitrogen, as an inert gas, can play a protective role. During packaging and transportation, nitrogen is used to seal the device to prevent adverse effects such as oxidation and corrosion. Dry nitrogen can be used for drying materials. During the drying process, nitrogen removes surface and internal moisture through forced air flow. It is commonly used in the manufacturing of microelectronics, optical devices, and powder coatings.

 

In the production of semiconductor devices, nitrogen can be used as an oxidant for surface oxidation treatments.

Nitrogen, due to its stability and availability, can maintain device surface uniformity while enhancing oxidation efficiency and avoiding the adverse effects of oxygen.

 

Purge is used to purge equipment and gas pipelines. When performing maintenance on equipment using toxic gases, nitrogen purge is performed instead of abruptly opening the chamber. Work is then performed only after ensuring safety.

 

The order of gas pipeline purging is: actual gas → nitrogen purge → atmosphere (the reverse order after maintenance). Safety must be ensured to prevent contamination from air, oxygen, or other gases. Dilution has two purposes. One is to control the oxidation rate of the thermal oxide film, as required by the dilution oxidation process. The other is to reduce the concentration of exhaust gases from the equipment to ensure safety. For example, dilution of SiH4 and hydrogen alloy exhaust reduces exhaust concentration to within the lower explosion limit to ensure safety. Base gases are typically used as base gases in diffusion furnaces. Base gases are also used to adjust the concentration of gas cylinders, for example, by mixing SiH4 with 20% nitrogen. Leak inspections are also used to check piping and C/C systems for leaks in nitrogen pressurization equipment.

 

Xida Heating Technology: Resolving the Safety Dilemma of Semiconductor Waste Gas Treatment, Ensuring Production Continuity and Equipment Safety

Semiconductor manufacturing generates large quantities of waste gases, many of which are corrosive, pyrophoric, or potentially explosive when exposed to air. Typically, these gases are diluted with nitrogen (N₂) in the early stages of waste gas treatment to ensure concentrations are below the lower explosion limit or to reduce corrosive effects.
However, mixing cooler nitrogen with the waste gas accelerates condensation, and when deposits accumulate, they can lead to unplanned downtime. Heating nitrogen is a better option, but only if new nitrogen leaks are not introduced into the system. Xida Heating Technology achieves this, meaning semiconductor manufacturers no longer have to balance safety concerns with potential downtime caused by exhaust system blockages.

• Preventing leaks reduces explosion risk.
• Preventing condensation reduces downtime for cleaning.
• Preventing corrosion on heating equipment, reducing the risk of equipment failure.
• Process updates increase the distance heated gas travels to ensure consistent pipe temperature over long distances.
• The structure is updated to reduce overall power consumption and save electricity.